This paper discusses the impact of transient behaviour of a semiconductor on the selection of you thermal management solution and why this study is required to come to the right selection of your heat sink and interface material. A selection based on average power will lead to the wrong selections and insufficient cooling of your device probably without knowing. An application with a MOSFET mounted on a heat sink is evaluated for both steady state and transient behaviour. The paper show the benefit of using electrical network analyses tools to solve this kind of thermal problems and make the right selections which will lead to the most optimal solution.
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